Burnishing is a simple and effective method for improvement in surface finish and can be carried out using
existing lathe machines. It also saves more on production costs than other conventional processes such as grinding. There
are many type of burnishing tools developed to satisfy the production requirements for achieving certain surface quality of
workpiece, comes at the forefront roller-burnishing tools. Burnishing can be considered as hardened, highly polished steel
rollers are brought into pressure contact with a softer piece part. The rotational and longitudinal of the operating
workpiece was analyzed before starting the turning and then burnishing. Two roller types of burnishing tools, which are
single and multi are used for burnishing carbon steel metal. Graphs are drawn on how these burnishing parameters vary
with the variation of the roller burnishing tools. A burnished surface is therefore smoother than an abraded surface with
the same roughness height measurement. Experimental work was carried out on a lathe to establish the effect of three
roller burnishing tool parameters; namely, burnishing speed, feed rate, burnishing force. The surface roughness and
roundness error of the turned test examples were enhanced by burnishing. The consequences of multi-roller burnishing
were superior to that of single-roller. The surface roughness increments with low burnishing force at high speed for
various feeds utilizing multi-roller burnishing.
The data presented shows a dependence of natural frequencies, peak amplitudes and damping levels of four audio
vibration modes in the different frequency range up to 1000 Hz on crack types and crack locations. Data from defective
single crystalline wafers exhibit lower natural frequencies, higher damping levels, and lower peak amplitudes. From the
results suggest an impact test method may be very useful for solar cell crack detection and quality control in the
photovoltaic industry. The aim is to experimentally conduct and detect cracks from vibration measurements introduced by
striking the single silicon wafer with an impact hammer. Such a method would reduce costs in the production of solar cells
or photovoltaic industry